Electro Services
Production Facilities
- RoHs Compliant Assembly Facility
- Leaded Assembly Facility on request
- PCB Assembly, Cableforming, and full unit Assembly
- Flowsolder and Conformal Coating
- Full Functional Test Facilities
BGA XRAY and Rework & Inspection Facility
All BGA placements are inspected through our Glenbrook RTH113HV X-Ray System. This system is used for all internal BGA placements but can also be used for sub-contract BGA inspection. An Ersa IR550 SMT Rework System is also available for sub-contract rework. Inspection Department including:- Two ITOCHU ATE Flying Probe Test Machines and Mirtec MV-3L 5 Camera AOI Inspection Equipment.
Surface Mount Facility
- Line 1 – I-Pulse M1, Surface Mount Line, placing 0201′s, Fine Pitch QFN’s and BGA’s
- Line 2 – I-Pulse M4, Surface Mount Line, placing 0201′s, Fine Pitch QFN’s and BGA’s
- Line 3 – Juki, Surface Mount Line, placing 0603′s
- Total placement capacity per hour = 57,000 components
- Supported by DEK 249 Automatic Solder Paste Screen Printers, SM-Tech Semiautomatic Screen Printer, Plus 12 Full Convection Reflow Oven and Manix Infra-Red Reflow Oven




